诺普得

Semiconductor & Electronics

WechatIMG249.pngThe production of an IC chip requires highly specialized equipment that operates under a variety of challenging environments such as:

  •   Plasma under vacuum

  •   Elevated  temperature

  •   Contact with highly abrasive solutiuons

  •   Exposure to a variety of very aggressive chemicals

Mitsubishi Chemical Advanced Materials Engineering Plastic Products has developed materials that meet the strictest requirements for low contamination consistent wafer manuafacturing, yet with a focus on delivering low-cost solutions vs traditional materials such as quartz and ceramics.  Mitsubishi Chemical Advanced Materials materials are designed to be used throughout the wafer production process.

Your Advantages

  •   Copy exact materials available anywhere on the globe.

  •   Extensive material selection, engineering support and testing capabilities.

  •  Machining capability to support quick turn NPI application development.

  •  The most extensive portfolio of materials specifically designed for use in Wet Process Tools.

  •  The global leader in manufacturing the materials used for CMP ring applications including Techtron® PPS, the global standard for CMP applications.

  •  Materials designed to deliver cost and performance for Dry Process Tools such as Etch, CVD and Ion Implant.

Products & Applications

Products

Applications

  • Techtron® PPS

  • Semitron® CMP XL20

  • Ketron® 1000 PEEK

  • Ertalyte® PET-P

  • Duratron® PAI

  • CMP rings

  • Etch and CVD chamber applications

  • Wafer handling applications

  • Wet Process structural applications

  • Wet Process components

    Linings of storage containers for HP chemicals and water